Conductospheres

Microsphere Technology ConductospheresCONDUCTOSPHERES™ are a range of lightweight conductive fillers consisting of hollow glass microspheres coated with a thin layer of metal.

They can be incorporated into coatings, composites and adhesives to provide these materials with electrical conductivity and shield against electromagnetic interference (EMI).

Due to their hollow core, CONDUCTOSPHERES have very low particle densities and so provide significant weight reductions over conventional metal fillers.

The CONDUCTOSPHERES range (more info) includes silver and nickel products with a variety of particle sizes, densities and crush strengths.

CONDUCTOSPHERES Silver

 

Product Average particle size (µm) Particle size range (µm) True particle density (g/cm³) Bulk density (g/cm³) Crush strength (psi) Data sheet
M-18-AG 17 5–30 0.72 0.34 28000
M-30-AG 27 10–45 0.62 0.37 18000
M-40-AG 36 15–70 0.49 0.29 6000
M-45-AG 43 15–80 0.32 0.20 2000
M-60-AG 74 25–120 0.16 0.10 300

 

CONDUCTOSPHERES Nickel

 

Product Average particle size (µm) Particle size range (µm) True particle density (g/cm³) Bulk density (g/cm³) Crush strength (psi) Data sheet
M-18-NI 17 5–30 0.69 0.32 28000

Custom orders are also available where the properties of the CONDUCTOSPHERES can be tailored to meet the customer’s specifications.


The graph below shows typical surface resistivities of coatings containing CONDUCTOSPHERES Silver and CONDUCTOSPHERES Nickel. Further data is available on the flyer below.

resistivity

 


Title Download
CONDUCTOSPHERES Silver – Flyer Click to open
CONDUCTOSPHERES Silver – MSDS Click to open
CONDUCTOSPHERES – Handling note Click to open